ASUS has just announced the super-compact but powerful ASUS ZenFone 9.
As we already mentioned, the ZenFone 9 is a sub 6-inch phone with super-compact design. Well, it's actually not that small: we're talking 146.5 x 68.1 x 9.1 mm, which shouldn't tell you much, but here goes: while the phone is as tall as the Galaxy S22, it's narrower yet thicker. With a side frame made of aluminum, it only weighs 169 grams, but does not skimp on the premium features we’ve come to expect of any flagship phone these days.
The phone also adopts the trendy right angle design language that does away with curved glass and relies on industrial right angles and edgy frames, similar to what Apple and Samsung have been doing for a while. ASUS' unique polycarbonate back cover aims to provide a steady grip while simultaneously being immune to fingerprint smudges, the very bane of modern phone design...
An interesting design peculiarity is the multi-functional ZenTouch button on the side of the phone, which doubles as a capacitive fingerprint sensor and aims to improve the single-hand usage of the phone according to ASUS. Thanks to this button, the user can swipe up and down and interact with the interface with the phone without touching the display. Nifty!
The ZenFone 9 will be available in four colors: Black, Blue, Red, and White, which definitely look classy and sophisticated. Check them out right below!Qualcomm's latest Snapdragon 8+ Gen 1 chipset is the one making the ZenFone 9 purr, and that one is a way improved version of the slightly disappointing Snapdragon 8 Gen 1 from the first half of the year, which was plagued by overheating issues and questionable efficiency.
The phone reins in the power of the Snapdragon with a new vapor chamber and moves away from the heat pipes of the previous generation ZenFone 8. What's more, there's a host of copper, graphite sheets, and thermal paste thrown in to further keep the phone cool. Bring on the heat, but not literally, that is!
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